3D measurement system
2D precision measurement and 3D contour measurement of various products through optical inspection technology
Equipment for 2D image and 3D profile measurement for various industries
Features：
- Compact size
- Replaces traditional 2D image measuring instruments (OMM) and probe type coordinate measuring instruments (CMM)
- Micron-level 2D and 3D measurement accuracy
Applications:
- Wafer flatness, warpage measurement
- IC BGA coplanarity, ball offset and diameter measurement
- Precision machining mold measurement, Dimension measurement (length, width, diameter, position deviation, height difference, thickness)
